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"Reliability of Cu nanoparticle joint for high temperature power electronics."

Toshitaka Ishizaki et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.113

access: closed

type: Journal Article

metadata version: 2022-04-01

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  - https://dblp.org/rec/journals/mr/IshizakiKTYOSY14
Toshitaka Ishizaki, A. Kuno, A. Tane, Masashi Yanase, F. Osawa, T. Satoh, Yasushi Yamada:
Reliability of Cu nanoparticle joint for high temperature power electronics. Microelectron. Reliab. 54(9-10): 1867-1871 (2014)

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