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"Corrosion behavior, whisker growth, and electrochemical migration of ..."

L. Hua, C. Yang (2011)

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DOI: 10.1016/J.MICROREL.2011.06.023

access: closed

type: Journal Article

metadata version: 2020-02-22

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L. Hua, C. Yang:
Corrosion behavior, whisker growth, and electrochemical migration of Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution. Microelectron. Reliab. 51(12): 2274-2283 (2011)

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