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"Electrochemical corrosion and electrochemical migration of 64Sn-35Bi-1Ag ..."

L. Hua, H. N. Hou (2017)

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DOI: 10.1016/J.MICROREL.2017.06.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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L. Hua, H. N. Hou:
Electrochemical corrosion and electrochemical migration of 64Sn-35Bi-1Ag solder doping with xGe on printed circuit boards. Microelectron. Reliab. 75: 27-36 (2017)

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