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"Characteristic of copper wire and transient analysis on wirebonding process."

Hsiang-Chen Hsu et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.11.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/HsuCYL11
Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai:
Characteristic of copper wire and transient analysis on wirebonding process. Microelectron. Reliab. 51(1): 179-186 (2011)

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