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"Planar copper-tin inter-metallic film formation on strained substrates."

Feng-Chih Hsu et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.02.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/HsuCWLC14
Feng-Chih Hsu, Ya-Chi Cheng, Yu-Ting Wang, Ming-Tzer Lin, Chih-Ming Chen:
Planar copper-tin inter-metallic film formation on strained substrates. Microelectron. Reliab. 54(6-7): 1378-1383 (2014)

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