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"A reliability model for SAC solder covering isothermal mechanical cycling ..."

Dominik Herkommer, Jeff M. Punch, Michael Reid (2010)

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DOI: 10.1016/J.MICROREL.2009.08.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Dominik Herkommer, Jeff M. Punch, Michael Reid:
A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions. Microelectron. Reliab. 50(1): 116-126 (2010)

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