"Reliability evaluation of tungsten donut-via as an element of the highly ..."

Verena Hein et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.07.136

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type: Journal Article

metadata version: 2020-02-22

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Verena Hein, Marco Erstling, Raj Sekar Sethu, Kirsten Weide-Zaage, Tianlin Bai:
Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. Microelectron. Reliab. 64: 259-265 (2016)

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