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"Dependence of copper interconnect electromigration phenomenon on barrier ..."

Masashi Hayashi, Shinji Nakano, Tetsuaki Wada (2003)

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DOI: 10.1016/S0026-2714(03)00273-7

access: closed

type: Journal Article

metadata version: 2020-02-22

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Masashi Hayashi, Shinji Nakano, Tetsuaki Wada:
Dependence of copper interconnect electromigration phenomenon on barrier metal materials. Microelectron. Reliab. 43(9-11): 1545-1550 (2003)

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