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"Design issues of a three-dimensional packaging scheme for power modules."

Shatil Haque et al. (2001)

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DOI: 10.1016/S0026-2714(00)00208-0

access: closed

type: Journal Article

metadata version: 2023-11-12

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  - https://dblp.org/rec/journals/mr/HaqueSCWLBL01
Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dushan Boroyevich, Guo-Quan Lu:
Design issues of a three-dimensional packaging scheme for power modules. Microelectron. Reliab. 41(2): 295-305 (2001)

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