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"Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level ..."

Jian Gu et al. (2018)

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DOI: 10.1016/J.MICROREL.2017.10.014

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jian Gu, Jian Lin, Yongping Lei, Hanguang Fu:
Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling. Microelectron. Reliab. 80: 29-36 (2018)

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