"Sub-pixel image correlation: an alternative to SAM and dye penetrant for ..."

Jason Y. L. Goh et al. (2004)

> Home

Details and statistics

DOI: 10.1016/S0026-2714(03)00162-8

access: closed

type: Journal Article

metadata version: 2024-10-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/GohPSSV04
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/GohPSSV04
Jason Y. L. Goh, Mark C. Pitter, Chung W. See, Michael G. Somekh, Daniel Vanderstraeten:
Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages. Microelectron. Reliab. 44(2): 259-267 (2004)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.