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"A three-scale approach to the numerical simulation of metallic bonding for ..."

Aldo Ghisi et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.054

access: closed

type: Journal Article

metadata version: 2020-02-22

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Aldo Ghisi, Stefano Mariani, Alberto Corigliano, Giorgio Allegato, Laura Oggioni:
A three-scale approach to the numerical simulation of metallic bonding for MEMS packaging. Microelectron. Reliab. 54(9-10): 2039-2043 (2014)

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