"Fundamentals of Lead-Free Solder Interconnect Technology (from ..."

Chong Leong Gan, Uda Hashim (2015)

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DOI: 10.1016/J.MICROREL.2015.02.010

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type: Journal Article

metadata version: 2020-02-22

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Chong Leong Gan, Uda Hashim:
Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online). Microelectron. Reliab. 55(5): 852 (2015)

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