"Effect of bonding pressure on reliability of flip chip joints on flexible ..."

Laura Frisk, Anne Seppälä, Eero Ristolainen (2004)

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DOI: 10.1016/J.MICROREL.2004.07.014

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type: Journal Article

metadata version: 2020-02-22

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Laura Frisk, Anne Seppälä, Eero Ristolainen:
Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates. Microelectron. Reliab. 44(9-11): 1305-1310 (2004)

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