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"Analysis of in situ monitored thermal cycling benefits for wireless ..."
Michael Ferrara et al. (2012)
- Michael Ferrara, Michael Stephens, Leslie Marchut, Chris Yang, Ventony Fryar, Preston Scott:
Analysis of in situ monitored thermal cycling benefits for wireless packaging early reliability evaluation. Microelectron. Reliab. 52(1): 9-15 (2012)
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