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"Rotational solder self-alignment mechanics modeling for a flip chip in the ..."

Brett Fennell, Sangil Lee, Daniel F. Baldwin (2016)

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DOI: 10.1016/J.MICROREL.2016.07.144

access: closed

type: Journal Article

metadata version: 2020-02-22

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Brett Fennell, Sangil Lee, Daniel F. Baldwin:
Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid. Microelectron. Reliab. 65: 217-224 (2016)

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