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"Validation of TSV thermo-mechanical simulation by stress measurement."

Wei Feng et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.01.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/FengWSAK16
Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi:
Validation of TSV thermo-mechanical simulation by stress measurement. Microelectron. Reliab. 59: 95-101 (2016)

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