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"Fabrication and stress analysis of annular-trench-isolated TSV."

Wei Feng et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.05.002

access: closed

type: Journal Article

metadata version: 2023-09-05

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  - https://dblp.org/rec/journals/mr/FengTWSAK16
Wei Feng, Tung Thanh Bui, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi:
Fabrication and stress analysis of annular-trench-isolated TSV. Microelectron. Reliab. 63: 142-147 (2016)

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