"Copper wire bonding package decapsulation using the anodic protection method."

Hirohiko Endoh, Takuya Naoe (2015)

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DOI: 10.1016/J.MICROREL.2014.10.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hirohiko Endoh, Takuya Naoe:
Copper wire bonding package decapsulation using the anodic protection method. Microelectron. Reliab. 55(1): 207-212 (2015)

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