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"Effects of metallization thickness of ceramic substrates on the ..."

Laurent Dupont et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.07.057

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type: Journal Article

metadata version: 2024-01-25

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Laurent Dupont, Zoubir Khatir, Stéphane Lefebvre, S. Bontemps:
Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. Microelectron. Reliab. 46(9-11): 1766-1771 (2006)

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