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"The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the ..."

N. Duan et al. (2003)

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DOI: 10.1016/S0026-2714(03)00135-5

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/DuanSBK03
N. Duan, J. Scheer, J. Bielen, M. van Kleef:
The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates. Microelectron. Reliab. 43(8): 1317-1327 (2003)

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