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"On chip-package stress interaction."

W. D. van Driel, Dao-Guo Yang, G. Q. Zhang (2008)

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DOI: 10.1016/J.MICROREL.2008.06.039

access: closed

type: Journal Article

metadata version: 2020-02-22

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W. D. van Driel, Dao-Guo Yang, G. Q. Zhang:
On chip-package stress interaction. Microelectron. Reliab. 48(8-9): 1268-1272 (2008)

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