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"Reliability modelling for packages in flexible end-products."

W. D. van Driel et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.07.085

access: closed

type: Journal Article

metadata version: 2023-09-30

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  - https://dblp.org/rec/journals/mr/DrielSYUZAZ06
W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang:
Reliability modelling for packages in flexible end-products. Microelectron. Reliab. 46(9-11): 1880-1885 (2006)

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