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"Prediction of Delamination Related IC & Packaging Reliability Problems."
W. D. van Driel et al. (2005)
- W. D. van Driel, Marcel A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang:
Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectron. Reliab. 45(9-11): 1633-1638 (2005)
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