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"Coupling effects of mechanical vibrations and thermal cycling on ..."
Ying Ding et al. (2015)
- Ying Ding, Ruyu Tian, Xiuli Wang, Chunjin Hang, Fang Yu, Ling Zhou, Xiangang Meng, Yanhong Tian:
Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints. Microelectron. Reliab. 55(11): 2396-2402 (2015)
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