"Joining and package technology for 175 °C Tj increasing reliability ..."

Peter Dietrich (2014)

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DOI: 10.1016/J.MICROREL.2014.08.007

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type: Journal Article

metadata version: 2020-02-22

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Peter Dietrich:
Joining and package technology for 175 °C Tj increasing reliability in automotive applications. Microelectron. Reliab. 54(9-10): 1901-1905 (2014)

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