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"Effects of Ag addition and Ag3Sn formation on the mechanical ..."

Kunmo Chu et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.06.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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Kunmo Chu, Changseung Lee, Sung-Hoon Park, Yoonchul Sohn:
Effects of Ag addition and Ag₃Sn formation on the mechanical reliability of Ni/Sn solder joints. Microelectron. Reliab. 75: 53-58 (2017)

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