Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Measurement and simulation of interfacial adhesion strength between ..."

Tsung-Lin Chou et al. (2011)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2011.06.045

access: closed

type: Journal Article

metadata version: 2022-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/ChouYWHC11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/ChouYWHC11
Tsung-Lin Chou, Shin-Yueh Yang, Chung-Jung Wu, Cheng-Nan Han, Kuo-Ning Chiang:
Measurement and simulation of interfacial adhesion strength between SiO₂ thin film and III-V material. Microelectron. Reliab. 51(9-11): 1757-1761 (2011)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.