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"Drop impact reliability testing for lead-free and lead-based soldered IC ..."

Desmond Y. R. Chong et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.10.011

access: closed

type: Journal Article

metadata version: 2023-09-30

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Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low:
Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectron. Reliab. 46(7): 1160-1171 (2006)

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