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"Finite element based fatigue life estimation of the solder joints with ..."

Yung-Chuan Chiou, Yi-Ming Jen, Shih-Hsiang Huang (2011)

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DOI: 10.1016/J.MICROREL.2011.06.025

access: closed

type: Journal Article

metadata version: 2022-10-02

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Yung-Chuan Chiou, Yi-Ming Jen, Shih-Hsiang Huang:
Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth. Microelectron. Reliab. 51(12): 2319-2329 (2011)

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