"Fault isolation in semiconductor product, process, physical and package ..."

Jiann Min Chin et al. (2011)

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DOI: 10.1016/J.MICROREL.2011.06.061

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jiann Min Chin, Vinod Narang, Xiaole Zhao, Meng Yeow Tay, Angeline Phoa, Venkat Ravikumar, Lwin Hnin Ei, Soon Huat Lim, Chea Wei Teo, Syahirah Zulkifli, Mei Chyn Ong, Ming Chuan Tan:
Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview. Microelectron. Reliab. 51(9-11): 1440-1448 (2011)

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