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"Interval optimal design of 3-D TSV stacked chips package reliability by ..."

Hsin-En Cheng, Rong-Sheng Chen (2014)

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DOI: 10.1016/J.MICROREL.2014.08.018

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hsin-En Cheng, Rong-Sheng Chen:
Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method. Microelectron. Reliab. 54(12): 2881-2897 (2014)

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