"The experimental analysis and the mechanical model for the debonding ..."

Si Chen et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.08.005

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type: Journal Article

metadata version: 2024-04-10

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Si Chen, Zhizhe Wang, Yunfei En, Yun Huang, Fei Qin, Tong An:
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface. Microelectron. Reliab. 91: 52-66 (2018)

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