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"Effects of pre-bump probing and bumping processes on eutectic solder bump ..."

Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang (2006)

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DOI: 10.1016/J.MICROREL.2006.01.005

access: closed

type: Journal Article

metadata version: 2022-10-02

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Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang:
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. Microelectron. Reliab. 46(12): 2104-2111 (2006)

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