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"Reliability evaluation of BOAC and normal pad stacked-chip packaging using ..."

K. M. Chen, K. H. Tang, J. S. Liu (2008)

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DOI: 10.1016/J.MICROREL.2007.07.013

access: closed

type: Journal Article

metadata version: 2020-02-22

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K. M. Chen, K. H. Tang, J. S. Liu:
Reliability evaluation of BOAC and normal pad stacked-chip packaging using low-K wafers. Microelectron. Reliab. 48(3): 408-415 (2008)

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