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"Full ball shear metrology as defect detection and analysis tool for solder ..."

C. K. Chen et al. (2004)

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DOI: 10.1016/J.MICROREL.2004.07.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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C. K. Chen, W. A. Tan, H. S. Goh, Y. S. Yip, W. T. Saw:
Full ball shear metrology as defect detection and analysis tool for solder joint reliability assessment on direct immersion gold technology. Microelectron. Reliab. 44(9-11): 1281-1285 (2004)

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