"Protrusion of electroplated copper filled in through silicon vias during ..."

Si Chen et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.04.005

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type: Journal Article

metadata version: 2023-03-21

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Si Chen, Fei Qin, Tong An, Pei Chen, Bin Xie, Xunqing Shi:
Protrusion of electroplated copper filled in through silicon vias during annealing process. Microelectron. Reliab. 63: 183-193 (2016)

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