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"Void-free and high-speed filling of through ceramic holes by copper ..."

Zhen Chen et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.06.074

access: closed

type: Journal Article

metadata version: 2020-02-22

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Zhen Chen, Yang Peng, Hao Cheng, Zizhou Yang, Mingxiang Chen:
Void-free and high-speed filling of through ceramic holes by copper electroplating. Microelectron. Reliab. 75: 171-177 (2017)

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