"Isothermal aging effects on the microstructure and solder bump shear ..."

W.-M. Chen, Paul McCloskey, S. Cian O'Mathuna (2006)

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DOI: 10.1016/J.MICROREL.2005.06.006

access: closed

type: Journal Article

metadata version: 2021-10-14

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W.-M. Chen, Paul McCloskey, S. Cian O'Mathuna:
Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders. Microelectron. Reliab. 46(5-6): 896-904 (2006)

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