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"Effects of underfill materials on the reliability of low-K flip-chip ..."

K. M. Chen et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.05.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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K. M. Chen, D. S. Jiang, N. H. Kao, J. Y. Lai:
Effects of underfill materials on the reliability of low-K flip-chip packaging. Microelectron. Reliab. 46(1): 155-163 (2006)

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