"Benzocyclobutene polymer filling of high aspect-ratio annular trenches for ..."

Qianwen Chen, Cui Huang, Zheyao Wang (2012)

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DOI: 10.1016/J.MICROREL.2012.06.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Qianwen Chen, Cui Huang, Zheyao Wang:
Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs). Microelectron. Reliab. 52(11): 2670-2676 (2012)

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