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"Thermal resistance of side by side multi-chip package: Thermal mode analysis."

Dao-Long Chen et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.02.016

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/ChenCYL15
Dao-Long Chen, Tei-Chen Chen, Ping-Feng Yang, Yi-Shao Lai:
Thermal resistance of side by side multi-chip package: Thermal mode analysis. Microelectron. Reliab. 55(5): 822-831 (2015)

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