"Development of a mathematical model for thermal-compression bonding of the ..."

Ching-Ho Chang, Wen-Bin Young (2011)

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DOI: 10.1016/J.MICROREL.2010.11.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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Ching-Ho Chang, Wen-Bin Young:
Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA. Microelectron. Reliab. 51(4): 860-865 (2011)

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