"Strength and reliability of low temperature transient liquid phase bonded ..."

Mads Brincker et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.06.041

access: closed

type: Journal Article

metadata version: 2020-02-22

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Mads Brincker, S. Söhl, R. Eisele, Vladimir N. Popok:
Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects. Microelectron. Reliab. 76-77: 378-382 (2017)

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