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"Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo ..."

Mads Brincker et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.06.051

access: closed

type: Journal Article

metadata version: 2020-02-22

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Mads Brincker, Peter Kjær Kristensen, S. Söhl, R. Eisele, Vladimir N. Popok:
Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates. Microelectron. Reliab. 88-90: 774-778 (2018)

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