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"Extended metallization reliability testing: Combining standard wafer level ..."

V. Born et al. (2009)

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DOI: 10.1016/J.MICROREL.2008.10.017

access: closed

type: Journal Article

metadata version: 2023-11-14

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V. Born, M. Beck, O. Bosholm, D. Dalleau, S. Glenz, I. Haverkamp, G. Kurz, F. Lange, Anja Vest:
Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity. Microelectron. Reliab. 49(1): 74-78 (2009)

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