"Highlighting two integration technologies based on vias: Through silicon ..."

M. Balmont et al. (2018)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2018.06.077

access: closed

type: Journal Article

metadata version: 2021-10-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/BalmontBPBO18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/BalmontBPBO18
M. Balmont, Isabelle Bord-Majek, B. Poupard, Laurent Béchou, Yves Ousten:
Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability. Microelectron. Reliab. 88-90: 1108-1112 (2018)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.