"3D Electro-thermal modelling of bonding and metallization ageing effects ..."

Toufik Azoui et al. (2011)

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DOI: 10.1016/J.MICROREL.2011.06.018

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type: Journal Article

metadata version: 2024-10-06

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Toufik Azoui, Patrick Tounsi, Philippe Dupuy, L. Guillot, Jean-Marie Dorkel:
3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs. Microelectron. Reliab. 51(9-11): 1943-1947 (2011)

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