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"A thermal cycling reliability study of ultrasonically bonded copper wires."

Elaheh Arjmand et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.01.009

access: open

type: Journal Article

metadata version: 2022-10-02

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  - https://dblp.org/rec/journals/mr/ArjmandACLMJ16
Elaheh Arjmand, Pearl A. Agyakwa, Martin R. Corfield, Jianfeng Li, Bassem Mouawad, C. Mark Johnson:
A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectron. Reliab. 59: 126-133 (2016)

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