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"Fine pitch copper wire bonding in high volume production."
Bernd K. Appelt et al. (2011)
- Bernd K. Appelt, Andy Tseng, Chun-Hsiung Chen, Yi-Shao Lai:
Fine pitch copper wire bonding in high volume production. Microelectron. Reliab. 51(1): 13-20 (2011)
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